June 19, 2012
Altair Semiconductor (http://www.localhost/Titan/Altair/altair-dev), a leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets, today announced that its FourGee-3100/6202 chipset successfully completed TD/FDD LTE live handover testing with Rohde & Schwarz, the leading global manufacturer of wireless communications and EMC test and measurement equipment. The test, which employed Altair’s FourGee™ chipset in an end-user device, successfully enabled seamless communication between different LTE modes, achieving an uninterrupted and continuous data session with low handover latency from a 20MHz TD-LTE channel and a 10MHz FDD channel and back.
The two companies are presenting a joint demo of their handover capabilities at the Global TD-LTE Initiative (GTI) Asia Conference on June 18-20th in China.
“The ramifications of live LTE handover are major, addressing one of the LTE industry’s most desired goals – harmonization of all standard variants. Our baseband portfolio, complemented by our multiband radio chipsets, offer the market’s most flexible and global solution,” said Eran Eshed, Co-Founder and VP of Marketing at Altair Semiconductor. “Since introducing the industry’s first LTE chipset in 2009, Altair has consistently been first to market with introducing numerous important LTE features.”